[O-RING]EXQUⓇ P260C FFKM Perfluoroelastomer

[O-RING]EXQUⓇ  P260C FFKM Perfluoroelastomer




EXQU® P260C

Main characteristics
The EXQU® P260C product is excellent in the wide range of chemical resistance and especially designed for extreme plasma process of semiconductors. This product is suitable for the static and dynamic dry processes such as HDPCVD, PECVD, etc. with the low outgassing characteristics by applying a special technique to polymerize PTFE nanoparticles into the perfluoroelastomer to improve superior plasma resistance in the oxygen and fluorine plasma process and minimize the dust.
Stable operating temperature is recommended up to 260˚C.



Features and advantages

Ultra-high purity and low metal ion content / Minimizing contamination with low surface corrosion / Excellent mechanical properties / Low outgassing



Application fields

Bonded Slit valve seals / Bonded Gate valve seals / Chamber lip seals / Gas inlet seals / Isolation valve seal



[O-RING]EXQUⓇ  P260C FFKM Perfluoroelastomer

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