EXQUⓇ P300B FFKM Perfluoroelastomer
EXQUⓇ P300B FFKM Perfluoroelastomer
Application fields
Chamber lip seals / Bonded slit valve door seals / Bonded Gate valve door seals / Gas inlet seals
EXQU® P300B
Main characteristics
EXQU®P300B is designed for dry etching, ashing, PVD and CVD (Chemical Vapor Deposition) processes in semiconductors with extreme plasma, high energy and high temperature. It exhibits the properties of reduced contamination, minimized weight loss and minimized degassing in oxygen and fluoro plasma environments. It has superb physical characteristics and mechanical properties such as excellent resistance to various chemicals and low compression set, maintains seal reliability in a vacuum condition for a long time, and is applied suitably to both static and dynamic applications.
EXQU®P300B is designed for dry etching, ashing, PVD and CVD (Chemical Vapor Deposition) processes in semiconductors with extreme plasma, high energy and high temperature. It exhibits the properties of reduced contamination, minimized weight loss and minimized degassing in oxygen and fluoro plasma environments. It has superb physical characteristics and mechanical properties such as excellent resistance to various chemicals and low compression set, maintains seal reliability in a vacuum condition for a long time, and is applied suitably to both static and dynamic applications.
Features and advantages
Superior plasma resistance / Low outgas / Low compression set / Excellent chemical resistance / Stable heat resistance
Application fields
Chamber lip seals / Bonded slit valve door seals / Bonded Gate valve door seals / Gas inlet seals
EXQUⓇ P300B FFKM Perfluoroelastomer
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